Magnetron sputtering vacuum coating equipment that is also known as high-speed and low-temperature sputtering method, is a very effective method of thin film deposition, compared with the evaporation method, have combined with strong coating layer and the substrate, the coating layer of dense, uniform, composition easy-controlling and other advantages. It has applied into the microelectronics, optical film materials and other fields with film deposition and surface treatment.

Sputtering is that, a vacuum coating machine occurs in ion collisions with surface atoms of the material during the transmission of energy and momentum, the complex process of excitation of surface atoms will eventually come out of the material. Ar + sputtering process to several tens of electron volts directly bombardment energy, over the surface of the material to the surface atoms, so that obtains sufficient energy to overcome the surface binding energy, while a certain energy into the vacuum chamber, then deposited onto the substrate surface. These solid materials that tested by atomic bombardment commonly refers to a target, after sputtering, there may be radical, often regarded as the sputtered atoms.

Magnetron sputtering vacuum coating machine is formed on the top surface of the cathode target in an orthogonal electromagnetic field. The secondary electrons generated in the cathode sputtering bit area are accelerated to high energy electrons, it does not directly toward the anode, but do back and forth testimony approximate cycloid movement in the orthogonal electromagnetic field. The high-energy electrons constantly collide with the gas molecules in movement, then transfer energy to the latter, making itself into a low-energy electron ionization. These low-energy electrons eventually drift to the vicinity of the cathode along the magnetic field lines, and then absorbed, thus avoiding the intense high-energy electron bombardment on the substrate, in order to eventually be absorbed by the anode, the general electronic should be gone through meters flight, its magnetron sputtering has high ionization efficiency and easily to discharge.

Usage of magnetron sputtering vacuum coating equipment is very wide, can be prepared into a variety of target materials and film material, including various metals, semiconductors, ferromagnetic materials, insulating oxides, ceramics, polymeric matter and other substances. Under appropriate conditions, it can be deposited in required mixed film with co-sputtering technique; may also be added oxygen, nitrogen, or other reactive gas discharge in the sputtering atmosphere, the compound of the target material and reactive gas molecules deposited film; its advantage is not required target conductivity. Reactive sputtering can be either DC reactive sputtering, but be a radio frequency reactive sputtering. Co-sputtering using two target cathodes that are prepared by different materials, while sputtering, cathodic sputtering by adjusting the discharge current, to change the composition of the film. Also available in a major surface of the target, fixed or paste other material sheet, to achieve a total splash.

Magnetron sputtering vacuum coating equipment that is also known as high-speed and low-temperature sputtering method, is a very effective method of thin film deposition, compared with the evaporation method, have combined with strong coating layer and the substrate, the coating layer of dense, uniform, composition easy-controlling and other advantages. It has applied into the microelectronics, optical film materials and other fields with film deposition and surface treatment.

Sputtering is that, a vacuum coating machine occurs in ion collisions with surface atoms of the material during the transmission of energy and momentum, the complex process of excitation of surface atoms will eventually come out of the material. Ar + sputtering process to several tens of electron volts directly bombardment energy, over the surface of the material to the surface atoms, so that obtains sufficient energy to overcome the surface binding energy, while a certain energy into the vacuum chamber, then deposited onto the substrate surface. These solid materials that tested by atomic bombardment commonly refers to a target, after sputtering, there may be radical, often regarded as the sputtered atoms.

Magnetron sputtering vacuum coating machine is formed on the top surface of the cathode target in an orthogonal electromagnetic field. The secondary electrons generated in the cathode sputtering bit area are accelerated to high energy electrons, it does not directly toward the anode, but do back and forth testimony approximate cycloid movement in the orthogonal electromagnetic field. The high-energy electrons constantly collide with the gas molecules in movement, then transfer energy to the latter, making itself into a low-energy electron ionization. These low-energy electrons eventually drift to the vicinity of the cathode along the magnetic field lines, and then absorbed, thus avoiding the intense high-energy electron bombardment on the substrate, in order to eventually be absorbed by the anode, the general electronic should be gone through meters flight, its magnetron sputtering has high ionization efficiency and easily to discharge.

Usage of magnetron sputtering vacuum coating equipment is very wide, can be prepared into a variety of target materials and film material, including various metals, semiconductors, ferromagnetic materials, insulating oxides, ceramics, polymeric matter and other substances. Under appropriate conditions, it can be deposited in required mixed film with co-sputtering technique; may also be added oxygen, nitrogen, or other reactive gas discharge in the sputtering atmosphere, the compound of the target material and reactive gas molecules deposited film; its advantage is not required target conductivity. Reactive sputtering can be either DC reactive sputtering, but be a radio frequency reactive sputtering. Co-sputtering using two target cathodes that are prepared by different materials, while sputtering, cathodic sputtering by adjusting the discharge current, to change the composition of the film. Also available in a major surface of the target, fixed or paste other material sheet, to achieve a total splash.