When you are on your smartphone or tablet with a finger, a variety of pages will appear, which is the result of a transparent conductive film on the screen.

 Now let us know the magnetron sputtering target used to produce transparent conductive films. It is one of the most rapidly developed and widely used targets in many sputtering targets. It is widely used in flat panel display, energy-saving low-emissivity glass, LED, semiconductor components and other industries.

1. Classification of magnetron sputtering targets
Depending on the composition of the material, the target can be classified into a metal target, an alloy target, an inorganic non-metal target, and the like. Among them, inorganic non-metallic targets can be divided into oxide, silicide, nitride and fluoride.
Depending on the geometry, the target can be divided into long (positive) square shaped targets, cylindrical targets and irregular shaped targets; in addition, the target can be divided into solid and hollow types of targets.
At present, the most commonly used classification methods for targets are based on the target application fields, including semiconductor application targets, recording medium application targets, display film application targets, optical targets, and superconducting targets.
Among them, targets for semiconductors, targets for recording media, and display targets are the three types of targets with the largest market demand.
2 . Application fields of magnetron sputtering targets
 Magnetron sputtering targets are mainly used in electronics and information industries, such as integrated circuits, information storage, liquid crystal storage, liquid crystal displays, electronic control devices, etc. They can also be used in the field of glass coating, and can also be applied to wear-resistant materials and high temperature resistance. Eclipse, chemical plating, metal foam materials, high-end decorative products and other industries.
2.1 Information Storage Industry
 In the information storage industry, related film products prepared using sputtering targets include hard disks, magnetic heads, optical disks (CD-R, CD, DVD), magneto-optical phase change optical disks (MO, C-RW, DVD-KAM).
2.2 Integrated Circuit Industry
Targets for integrated circuits account for a large share of the global target market. The sputtering products mainly include an electrode interconnection film, a barrier film, a contact film, an optical disk mask, a capacitor electrode film, a resistance film, and the like.
2.3 Flat panel display industry
The flat panel display includes a liquid crystal display (LCD), a plasma display (PDP), an electroluminescent display (E-L), and a field emission display (PED). At present, the liquid crystal display LCD market is the largest in the flat panel display market, with a share of up to 80%.
2.4 Optical film industry
The targets used for glass coating are: In2O3, SnO2, Co-Cr, Cu, Cr, Ni, Sn, and the like. The target for automotive rear mirrors mainly includes: Cr, Al, SnO2, TiO2 and the like.
3. Method for preparing magnetron sputtering target
 The preparation method of magnetron sputtering target can be divided into two categories: melt casting method and powder metallurgy method. In the preparation process of target, in addition to strictly controlling material purity, density, grain size and crystallization In addition to the orientation, the heat treatment process conditions and subsequent molding processes need to be strictly controlled to ensure the quality of the target.
3.1 molten casting method
Compared with the powder metallurgy method, the target product produced by the melt casting method has a low impurity content and a high density.
3.2 Powder metallurgy
 In general, the molten casting method cannot realize the preparation of a refractory metal sputtering target. For two or more metals having a large difference in melting point and density, an ordinary molten casting method is used, and it is generally difficult to obtain a uniform alloy target. material;
 For inorganic non-metallic targets and composite targets, the melt casting method is powerless, and the powder metallurgy method is the best way to solve the technical problems of preparing the above targets. At the same time, the powder metallurgy process has the advantages of easy to obtain a uniform fine crystal structure, saving raw materials, and high production efficiency.