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This ALD Machine is a high-performance coating machine specially designed for advanced packaging technologies like TGV (Through-Glass Via) and TSV (Through-Silicon Via).
It can precisely deposit functional layers such as Ti, Cu, and Al₂O₃ on glass or silicon substrates to create high-quality insulation and seed layers, meeting the strict requirements of advanced packaging for reliability and microstructure precision.
Key Features of Advanced Packaging TGV & TSV Atomic layer deposition equipment
Tailored ALD solutions for your advanced packaging needs
Designed for conductive vias, insulating layers, and seed layers in advanced packaging
Precise control and uniformity help reduce defects and improve packaging yield
Supports smaller sizes and more multi-layer designs to accelerate technology upgrades
atomic layer control to meet micro- and nanoscale deposition needs
High-density and highly conformal coatings for uniform, reliable coverage
| Substrate size | 50~300mm | 200x200mm | φ300x400mm |
| Precursor | 3-way precursor supply system: Liquid,solid, gaseous | ||
| Typical processes | Al2O3, TiO2, SiO2, Ta2O5, HfO2, TiN, AIN, etc | ||
| Pumping down time | 8.0x10-2Pa≤25min | ||
| Deposition temperature | 50~400C | ||
| Deposition rate | 8 s/cycle | ||
| Uniformity | ±1% | ||
| Optional ozone source/plasma source | |||
Looking for a solution tailored to your needs? Our team is ready to provide you with expert guidance and support.
