Vacuum coating machine Vacuum coating machine

Industry Application

Chip EMI package
With the complexity and integration of semiconductor design increasing with the development of technology, new packaging solutions have become a driving factor.
Package level electromagnetic shielding makes PCB smaller and thinner.
Packaged semiconductor components have the advantage of being able to be placed anywhere on the system board.
The adhesion between the semiconductor packaging material and the shielding layer is greatly improved by the surface modification of plasma treatment.
Physically, the surface area is increased by improving the surface roughness of semiconductor package.
vacuum coating machine

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