√With the complexity and integration of semiconductor design increasing with the development of technology, new packaging solutions have become a driving factor.
√Package level electromagnetic shielding makes PCB smaller and thinner.
√Packaged semiconductor components have the advantage of being able to be placed anywhere on the system board.
√The adhesion between the semiconductor packaging material and the shielding layer is greatly improved by the surface modification of plasma treatment.
√Physically, the surface area is increased by improving the surface roughness of semiconductor package.