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Main parameters affecting the sputtering of magnetron sputtering vacuum coating machine

2022-04-29

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       The magnetron sputtering vacuum coating machine is widely used in daily life and is very popular in the market. Therefore, everyone also pays special attention to the problems related to the coating technology of the magnetron sputtering vacuum coating machine. Today, I will introduce the influence of magnetron. What are the main parameters of sputtering vacuum coating machine?



magnetron sputtering vacuum coating machine



1. Sputtering threshold:
       The minimum energy value of the incident ion required to sputter out the target atoms. It has little relationship with the type of incident ions and is related to the target material. After the energy ion amount exceeds the sputtering threshold, with the increase of ion energy, before 150ev, the sputtering yield is proportional to the square of the ion energy; in the range of 150ev~1kev, the sputtering yield is proportional to the ion energy; In the range of 1kev~10kev, the sputtering yield does not change significantly; the sputtering yield shows a downward trend when the energy increases. Below are the sputtering thresholds for several metals bombarded with different incident ions.

2. Sputtering yield:
       When the incident ions bombard the target, the average number of atoms that each positive ion can hit from the target. The influencing factors mainly include the following aspects:
       1. The sputtering yield shows a certain periodicity with the change of the atomic number of the target material. With the increase of the electron filling degree of the atomic d shell of the target material, the sputtering yield becomes larger (approximate change trend).
       2. Influence of incident ion species on sputtering yield
       The sputtering yield increases periodically with increasing incident atomic number.
       Sputtering yields of silver, copper and tantalum corresponding to various incident ions at 45Kev
       3. Effect of ion incident angle on sputtering yield
       For the same target and incident ions, the sputtering yield increases with the increase of the ion incident angle. When the angle increases to 70⁰~80⁰, the sputtering yield is the largest. Continue to increase the incident angle, the sputtering yield decreases sharply, and the sputtering yield is zero at 90⁰.
       4. The effect of target temperature on sputtering yield
       Generally speaking, in a certain temperature range where it can be considered that the sputtering yield is closely related to the sublimation energy, the sputtering yield hardly changes with the change of temperature. When the temperature exceeds this range, the sputtering yield tends to increase sharply.
      The above two points are the biggest parameters affecting the sputtering of the magnetron sputtering vacuum coating machine. The changes of these two parameters directly involve the adhesion of the film layer, the structure of the film layer and other characteristics. Therefore, the parameters of sputtering are extremely important.