News centres

Home > News > Industry Trends > Introduction of vacuum coating machine for TiN ten Au+ Si02 film

Introduction of vacuum coating machine for TiN ten Au+ Si02 film

2021-01-23

645
Share

      The pvd coating machine uses the composite coating ion plating method to plate the TiN ten Au+ Si02 film on the brass electroplated bright nickel watch case. The pvd coating machine uses arc, magnetron sputtering, intermediate frequency or radio frequency sputtering ion plating multifunctional vacuum coating machine , Install 6 small plane arc source titanium targets for TiN plating on the wall of vacuum coating chamber, install columnar magnetron sputtering gold target for gold plating in the center, install 2 rectangular plane magnetron sputtering Si02 targets or Si target for Si02 plating on the wall. Adopt DC bias power supply.


pvd coating machine


        (1) The workpiece is cleaned, put on the shelf, and put into the furnace. The method is the same as before.
        (2) Vacuuming: The background vacuum is preferably 6.6 x 10-3 Pa, and the baking heating temperature is about 150°C.
        (3) Bombardment cleaning. The method is the same as before, including argon bombardment and titanium bombardment.
       (4) Coating
        ①Deposit titanium bottom layer
        Vacuum degree: pass high-purity argon gas, and keep the vacuum degree at 5 X 10-2Pa. Arc current: 50~70A, ignite all arc sources, time is 2~3min. Bias voltage: 400~500V.
        ②Deposit TiN film
        Vacuum degree: pass in high-purity nitrogen, keep the vacuum degree at s x 10-1Pa. Bias voltage: 100~200Vo Arc current: 60~80A. Deposition time: 10-20min, film thickness 0.1-0.5μm.
        ③Gold plating
        Vacuum degree: pass in high-purity nitrogen and keep the vacuum degree at 5 x 10-2Pa. Bias voltage: 100~150V. Arc current: 60A (1 source for ignition in the upper, middle and lower vacuum coating chamber). Magnetron sputtering gold target voltage: 400-500V, current 3-5A; time: 1min.
        ④Gold-plated
        Vacuum degree: argon gas is introduced, and the vacuum degree is maintained at 3 x 10-1Pa. Bias voltage: 100~150V. Sputtering target voltage: 400~550V. Time: 5-10min.
        ⑤Si02 deposition
        Vacuum degree: pass high-purity argon gas, vacuum degree 8 x 10-2Pa or 5x 10-1Pa. Intermediate frequency (RF) power supply: 200~500W. Time: 10-20min.
       (5) Cooling: first turn off the intermediate frequency (or radio frequency) power supply, then turn off the air source, and stop the turret. When the workpiece is cooled to 80-100°C in the vacuum chamber, the vacuum chamber is filled with air and the workpiece is taken out. This process is also called gold-doped plating or IPG. The last layer of Si02 is transparent and maintains the gold film. It can prolong the wear time of the gold film. It is optional according to customer requirements.
         The pvd coating machine is used to plate TiN + Au+ Si02 film. The basic steps of plating some common films are similar, but some key steps are completely different. Therefore, to achieve the desired effect, you must be cautious and careful That's all right.