News centres

Home > News > Industry Trends > The difference between vacuum plating, sputtering and coating of pvd coating machine

The difference between vacuum plating, sputtering and coating of pvd coating machine

2023-08-21

198
Share
        Many people are always ambiguous about the vacuum plating, sputtering and coating of the vacuum coating machine.
        The pvd coating machine uses PVD-Physical Vapor Deposition, which refers to the process of using physical processes to realize material transfer, and transfer atoms or molecules from the source to the surface of the substrate. Its function is to spray some particles with special properties (high strength, wear resistance, heat dissipation, corrosion resistance, etc.) on the matrix with lower performance, so that the matrix has better performance.

        pvd coating machine Vacuum coating basic method: vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, active reactive ion plating, radio frequency ion plating, DC discharge ion plating)


pvd coatiing machine


Vacuum evaporation, sputtering, ion plating
       Vacuum plating mainly includes several types of vacuum evaporation, sputtering and ion plating. They all use distillation or sputtering to deposit various metal and non-metal films on the surface of plastic parts under vacuum conditions. This method can obtain a very thin surface coating, and has the outstanding advantages of fast speed and good adhesion, but the price is also high, and there are fewer metal types that can be operated. It is generally used as a functional coating for higher-end products.
       The vacuum evaporation method is to heat the metal under high vacuum to make it melt and evaporate, and form a metal film on the surface of the sample after cooling. The thickness of the coating is 0.8-1.2um. It is necessary to fill up the micro unevenness on the surface of the molded product to obtain a mirror-like surface, regardless of whether vacuum deposition is performed to obtain a mirror effect or when vacuum deposition is performed on DURACON with low adhesion Undercoating treatment is carried out.
        Sputtering usually refers to magnetron sputtering, which belongs to the high-speed and low-temperature sputtering method. The process requires a vacuum degree of about 1×10-3Torr, that is, a vacuum state of 1.3×10-3Pa to be filled with inert gas argon (Ar), and between the plastic substrate (anode) and the metal target (cathode). When high-voltage direct current is applied, the electrons generated by glow discharge excite the inert gas to generate plasma, which blasts the atoms of the metal target and deposits them on the plastic substrate. Generally, DC sputtering is mostly used for metal coating, while RF AC sputtering is used for non-conductive ceramic materials.
        pvd coating machine ion plating is a method of using gas discharge to partially ionize the gas or evaporated substance under vacuum conditions, and deposit the evaporated substance or its reactant on the substrate under the bombardment of gas ions or evaporated substance ions. These include magnetron sputtering ion plating, reactive ion plating, hollow cathode discharge ion plating (hollow cathode evaporation method), multi-arc ion plating (cathode arc ion plating), etc.
Plating:
        Coating, also known as brush plating or slotless electroplating, is a technology for local rapid electrochemical deposition of metal on the surface of metal workpieces. Its principle and essence belong to the category of electroplating in electrochemical processing. Contrary to electrolysis, metal ions in the electroplating solution are plated and deposited on the cathode under the action of an electric field.