There are many kinds of magnetron sputtering, which are divided into DC magnetron sputtering, radio frequency magnetron sputtering, unbalanced magnetron sputtering, intermediate frequency magnetron sputtering and so on. Each has different working principles and application objects, but they have one thing in common: they use a magnetic field to interact with electrons to make electrons run in a spiral near the target surface, thus increasing the probability of electrons hitting argon gas to generate ions. The generated ions hit the target surface under the action of the electric field to sputter out the target material. Medium frequency magnetron sputtering pvd coating machine coating technology is widely used in daily life, so what is the difference and characteristics between it and other magnetron sputtering?

The intermediate frequency double target reactive magnetron sputtering method has many excellent properties for preparing thin films, many things cannot be achieved by ordinary DC magnetron sputtering or radio frequency sputtering. The characteristics are as follows:
     (1) The medium-frequency dual-target reactive magnetron sputtering refers to the high quality of the film, good film uniformity and structural characteristics due to the DC reactive sputtering method,
     (2) The deposition rate of intermediate frequency dual-target reactive magnetron sputtering is high. For silicon targets, the deposition rate of intermediate frequency reactive sputtering is 10 times that of DC reactive sputtering, and about 5 times higher than that of radio frequency sputtering.
     (3) The process of intermediate frequency double-target Sanskrit magnetron sputtering can be stabilized at the set working point, which not only eliminates the phenomenon of "sparking", but also overcomes the phenomenon of target poisoning and anode disappearance that often occur in the DC discharge state
     (4) The production cost of intermediate frequency power supply is lower, the equipment installation, debugging and maintenance are easier than radio frequency sputtering, and the operation is stable, and the matching of intermediate frequency power supply and target is easier than radio frequency power supply.
     (5) The substrate temperature is higher, which is conducive to improving the quality and bonding force of the film
     (6) Intermediate frequency dual-target reactive magnetron sputtering can achieve a sputtering rate similar to DC sputtering. Some studies have shown that the reactive sputtering deposition rate obtained by this method can reach 60%~70% of the metal sputtering rate. RF sputtering is usually an order of magnitude lower than DC sputtering.
       Medium-frequency magnetron sputtering pvd coating machine coating technology Double-target reactive magnetron sputtering has been applied in industrial production due to its high deposition rate and good working stability, and has received increasing attention.