The electromagnetic shielding film EMI of semiconductor chip is packaged. The EMI of package level makes PCB smaller and thinner, and has excellent performance and characteristics, which can provide reliable shielding and bonding performance in electronic conditions and environment under pressure. In addition, the packaged semiconductor components have the advantage that they can be placed anywhere on the system board. HCVAC have developed a continuous production line of magnetron sputtering which can form high quality electromagnetic shielding film.